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S6015

K7

● 不露卤素,无玻纤加强质料,适用于通例HDI建造工艺
不失落树脂粉,净化少
可取通例FR-4.0半固化片媲美的保存期
较低的介电常数,有利于特性阻抗掌握及进步旌旗灯号传输速度

应用领域

适用于建造无卤化趋向的手持式电子产品,如手机、PDA、数码摄像机等
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Items Method Condition Unit Typical Value
Tg 2.4.25D DSC
145
Thermal Stress
2.4.13.1
288℃/20s
- pass
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 3.4
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.018
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 5 x 108
Surface Resistivity
2.5.17.1
C-96/35/90 5 x 109
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 1.2
Flammability
UL94
C-48/23/50
Rating
V-0

K7

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.